Nexperia's manufacturing facilities are fully vertically integrated and deliver optimized high-volume production. We offer the highest capacity in the industry for various packages, and make continuous investments in new capacities. We’re safeguarding the long-term availability of our manufacturing processes and products, so our customers can count on a secure supply.
Front End Fabrication
The fab at our Hamburg site has existed since 1953 and now produces more than 35,000 wafers per month (8” equiv.). That translates to 70 billion semiconductors per year, making it the largest wafer fab optimized for small-signal and bipolar discrete devices in the world.
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Stresemannallee 101 22529 Hamburg Germany |
The dedicated 6“ TrenchMOS fabrication facility in Manchester is the home of our power MOSFETs. With current capacity of 24,000 wafers / month (8” equiv.) it continues to build on a semiconductor legacy of more than 30 years at the site.
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Bramhall Moor Lane, Pepper Rd, Hazel Grove |
Assembly and Testing
At over 80,000 m2 our facility in Guangdong is the largest small-signal assembly site with a capacity of over 50 billion pieces per year. It supports our high-runner and medium power SMD packages, as well as our DFN and wafer-scale options.
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Tianmei Industrial North |
Focused on multi-pin and high diversity packages, our site at Seremban handles the other 20 billion small-signal and bipolar pieces per year. Among its specialties are “Japanese” SMD packages and our FlatPower and XSON packages.
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No.12687, Tuanku Jaafar Industrial Park |
Just as Manchester is the home to front-end fabrication of our MOSFETs, the same can be said about Cabuyao for assembly and testing. Specializing in clip bond / power package capabilities (TO-220, DPAK, D2PAK, LFPAK), it can process approximately one billion pieces per year.
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Light Industry Science Park of the Phils |