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Chemical content 74ABT16245BDGG

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Type numberPackagePackage descriptionTotal product weight
74ABT16245BDGGSOT362-1TSSOP48195.14044 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352033901181412601235Nijmegen, Netherlands; D-22529 HAMBURG, Germany; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-47.3692080.100003.77636
PolymerResin systemProprietary1.8308019.900000.93820
subTotal9.20000100.000004.71456
DieDoped siliconSilicon (Si)7440-21-31.47209100.000000.75438
subTotal1.47209100.000000.75438
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.6500097.0000022.36851
Nickel (Ni)7440-02-01.350003.000000.69181
subTotal45.00000100.0000023.06032
Mould CompoundAdditiveNon hazardousProprietary6.392004.700003.27559
FillerSilica fused60676-86-0107.4400079.0000055.05778
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-88.160006.000004.18160
PigmentCarbon black1333-86-40.272000.200000.13939
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-65.440004.000002.78774
Non hazardousProprietary5.576004.100002.85743
Tetramethylbiphenyl diglycidyl ether85954-11-62.720002.000001.39387
subTotal136.00000100.0000069.69340
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.01640
Nickel (Ni)7440-02-03.1040097.000001.59065
Palladium (Pd)7440-05-30.064002.000000.03280
subTotal3.20000100.000001.63985
WirePure metalCopper (Cu)7440-50-80.26835100.000000.13751
subTotal0.26835100.000000.13751
total195.14044100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.