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Chemical content 74AHC138PW

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Type numberPackagePackage descriptionTotal product weight
74AHC138PWSOT403-1TSSOP1653.29462 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352630001182012601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.75148
PolymerResin systemProprietary0.0995019.900000.18670
subTotal0.50000100.000000.93818
DieDoped siliconSilicon (Si)7440-21-30.17725100.000000.33258
subTotal0.17725100.000000.33258
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-827.2916097.4700051.20892
Iron (Fe)7439-89-60.672002.400001.26092
Phosphorus (P)7723-14-00.008400.030000.01576
Zinc (Zn)7440-66-60.028000.100000.05254
subTotal28.00000100.0000052.53814
Mould CompoundAdditiveNon hazardousProprietary1.081004.700002.02835
FillerSilica fused60676-86-018.1700079.0000034.09350
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.58938
PigmentCarbon black1333-86-40.046000.200000.08631
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.72625
Non hazardousProprietary0.943004.100001.76941
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.86313
subTotal23.00000100.0000043.15633
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02815
Nickel (Ni)7440-02-01.4550097.000002.73011
Palladium (Pd)7440-05-30.030002.000000.05629
subTotal1.50000100.000002.81455
WirePure metalCopper (Cu)7440-50-80.11738100.000000.22024
subTotal0.11738100.000000.22024
total53.29462100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.