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Chemical content 74AHC164D

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Type numberPackagePackage descriptionTotal product weight
74AHC164DSOT108-1SO14123.13887 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352654651181612601235Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06326
PolymerAcrylic resinProprietary0.0152015.200000.01234
Resin systemProprietary0.006906.900000.00560
subTotal0.10000100.000000.08120
DieDoped siliconSilicon (Si)7440-21-30.15110100.000000.12271
subTotal0.15110100.000000.12271
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.25543
Iron (Fe)7439-89-61.068962.400000.86809
Phosphorus (P)7723-14-00.013360.030000.01085
Zinc (Zn)7440-66-60.044540.100000.03617
subTotal44.54000100.0000036.17054
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.96148
FillerSilica fused60676-86-061.2961079.0000049.77803
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.78061
PigmentCarbon black1333-86-40.155180.200000.12602
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.52041
Non hazardousProprietary3.181194.100002.58342
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.26020
subTotal77.59000100.0000063.01017
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00544
Nickel (Ni)7440-02-00.6499097.000000.52778
Palladium (Pd)7440-05-30.013402.000000.01088
subTotal0.67000100.000000.54410
WirePure metalCopper (Cu)7440-50-80.08776100.000000.07127
subTotal0.08776100.000000.07127
total123.13887100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.