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Chemical content 74AHC374PW

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Type numberPackagePackage descriptionTotal product weight
74AHC374PWSOT360-1TSSOP2079.85163 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352626811181112601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0594377.900000.07443
PolymerAcrylic resinProprietary0.0116015.200000.01452
Resin systemProprietary0.005266.900000.00659
subTotal0.07629100.000000.09554
DieDoped siliconSilicon (Si)7440-21-30.36045100.000000.45140
subTotal0.36045100.000000.45140
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.1435397.4700036.49710
Iron (Fe)7439-89-60.717602.400000.89867
Phosphorus (P)7723-14-00.008970.030000.01123
Zinc (Zn)7440-66-60.029900.100000.03744
subTotal29.90000100.0000037.44444
Mould CompoundAdditiveNon hazardousProprietary2.285144.700002.86173
FillerSilica fused60676-86-038.4098079.0000048.10146
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.917206.000003.65328
PigmentCarbon black1333-86-40.097240.200000.12178
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.944804.000002.43552
Non hazardousProprietary1.993424.100002.49640
Tetramethylbiphenyl diglycidyl ether85954-11-60.972402.000001.21776
subTotal48.62000100.0000060.88793
Pre-PlatingPure metal layerGold (Au)7440-57-50.007591.000000.00951
Nickel (Ni)7440-02-00.7362397.000000.92200
Palladium (Pd)7440-05-30.015182.000000.01901
subTotal0.75900100.000000.95052
WirePure metalCopper (Cu)7440-50-80.13589100.000000.17017
subTotal0.13589100.000000.17017
total79.85163100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.