Chemical content 74AHC574PW

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Type numberPackagePackage descriptionTotal product weight
74AHC574PWSOT360-1TSSOP2099.31512 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352630811181112601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.6821080.100001.69370
PolymerResin systemProprietary0.4179019.900000.42078
DieDoped siliconSilicon (Si)7440-21-30.58408100.000000.58811
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-838.9880097.4700039.25686
Iron (Fe)7439-89-60.960002.400000.96662
Phosphorus (P)7723-14-00.012000.030000.01208
Zinc (Zn)7440-66-60.040000.100000.04028
Mould CompoundAdditiveNon hazardousProprietary2.585004.700002.60283
FillerSilica fused60676-86-043.4500079.0000043.74963
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.300006.000003.32276
PigmentCarbon black1333-86-40.110000.200000.11076
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.200004.000002.21517
Non hazardousProprietary2.255004.100002.27055
Tetramethylbiphenyl diglycidyl ether85954-11-61.100002.000001.10759
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.01510
Nickel (Ni)7440-02-01.4550097.000001.46503
Palladium (Pd)7440-05-30.030002.000000.03021
WirePure metalCopper (Cu)7440-50-80.13104100.000000.13195
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.