Chemical content 74AHCT02PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT02PW-Q100SOT402-1TSSOP1459.72517 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300973118612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02609
PolymerAcrylic resinProprietary0.0030415.200000.00509
Resin systemProprietary0.001386.900000.00231
DieDoped siliconSilicon (Si)7440-21-30.28449100.000000.47634
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.44557
Iron (Fe)7439-89-60.462442.400000.77428
Phosphorus (P)7723-14-00.005780.030000.00968
Zinc (Zn)7440-66-60.019270.100000.03226
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.11627
FillerSilica fused60676-86-031.2840079.0000052.37993
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.97822
PigmentCarbon black1333-86-40.079200.200000.13261
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.65215
Non hazardousProprietary1.623604.100002.71845
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.32607
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02457
Nickel (Ni)7440-02-00.4514692.300000.75589
Palladium (Pd)7440-05-30.015163.100000.02539
Silver (Ag)7440-22-40.007831.600000.01310
WirePure metalCopper (Cu)7440-50-80.06315100.000000.10573
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.