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Chemical content 74AHCT138BQ

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Type numberPackagePackage descriptionTotal product weight
74AHCT138BQSOT763-1DHVQFN1621.31248 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855731151412601235Suzhou, China; Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37463
PolymerResin systemProprietary0.0198419.900000.09307
subTotal0.09968100.000000.46770
DieDoped siliconSilicon (Si)7440-21-30.24815100.000001.16432
subTotal0.24815100.000001.16432
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.74115
Iron (Fe)7439-89-60.198062.400000.92930
Phosphorus (P)7723-14-00.002480.030000.01162
Zinc (Zn)7440-66-60.008250.100000.03872
subTotal8.25236100.0000038.72079
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.69834
FillerSilica -amorphous-7631-86-90.434103.490002.03685
Silica fused60676-86-010.5503084.8200049.50293
PigmentCarbon black1333-86-40.019900.160000.09338
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.63031
Epoxy resin systemProprietary0.197771.590000.92796
Phenolic resinProprietary0.279872.250001.31315
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.15941
subTotal12.43846100.0000058.36233
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00983
Nickel (Ni)7440-02-00.1906391.000000.89444
Palladium (Pd)7440-05-30.016768.000000.07863
subTotal0.20948100.000000.98290
WirePure metalCopper (Cu)7440-50-80.0621496.550000.29156
Pure metal layerGold (Au)7440-57-50.000230.350000.00106
Palladium (Pd)7440-05-30.002003.100000.00936
subTotal0.06436100.000000.30198
total21.31248100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.