Chemical content 74AHCT138D

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Type numberPackagePackage descriptionTotal product weight
74AHCT138DSOT109-1SO16142.91953 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352629971181112601235Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01635
PolymerAcrylic resinProprietary0.0045615.200000.00319
Resin systemProprietary0.002076.900000.00145
DieDoped siliconSilicon (Si)7440-21-30.24815100.000000.17363
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.69405
Iron (Fe)7439-89-60.904202.400000.63266
Phosphorus (P)7723-14-00.011300.030000.00791
Zinc (Zn)7440-66-60.037680.100000.02636
Mould CompoundAdditiveNon hazardousProprietary4.900694.700003.42899
FillerSilica fused60676-86-082.3733079.0000057.63614
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.256206.000004.37743
PigmentCarbon black1333-86-40.208540.200000.14591
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.170804.000002.91829
Non hazardousProprietary4.275074.100002.99124
Tetramethylbiphenyl diglycidyl ether85954-11-62.085402.000001.45914
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00395
Nickel (Ni)7440-02-00.5480597.000000.38347
Palladium (Pd)7440-05-30.011302.000000.00791
WirePure metalCopper (Cu)7440-50-80.13139100.000000.09193
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.