Chemical content 74AHCT138PW

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Type numberPackagePackage descriptionTotal product weight
74AHCT138PWSOT403-1TSSOP1663.36552 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352629981181312601235Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.63205
PolymerResin systemProprietary0.0995019.900000.15703
DieDoped siliconSilicon (Si)7440-21-30.24815100.000000.39161
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700058.45229
Iron (Fe)7439-89-60.912002.400001.43927
Phosphorus (P)7723-14-00.011400.030000.01799
Zinc (Zn)7440-66-60.038000.100000.05997
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.70598
FillerSilica fused60676-86-018.1700079.0000028.67490
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.17784
PigmentCarbon black1333-86-40.046000.200000.07259
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.45189
Non hazardousProprietary0.943004.100001.48819
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.72595
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02367
Nickel (Ni)7440-02-01.4550097.000002.29620
Palladium (Pd)7440-05-30.030002.000000.04734
WirePure metalCopper (Cu)7440-50-80.11738100.000000.18523
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.