Chemical content 74AHCT157PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT157PW-Q100SOT403-1TSSOP1660.55126 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300687118712601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21871
PolymerAcrylic resinProprietary0.0258415.200000.04267
Resin systemProprietary0.011736.900000.01937
DieDoped siliconSilicon (Si)7440-21-30.35621100.000000.58828
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.89558
Iron (Fe)7439-89-60.475552.400000.78536
Phosphorus (P)7723-14-00.005940.030000.00982
Zinc (Zn)7440-66-60.019810.100000.03272
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39239
Silica fused60676-86-031.0186878.3300051.22714
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.98935
PigmentCarbon black1333-86-40.079200.200000.13080
PolymerEpoxy resin systemProprietary3.509358.862005.79567
Phenolic resinProprietary2.339575.908003.86378
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02492
Nickel (Ni)7440-02-00.4642592.300000.76671
Palladium (Pd)7440-05-30.015593.100000.02575
Silver (Ag)7440-22-40.008051.600000.01329
WirePure metalCopper (Cu)7440-50-80.10759100.000000.17768
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.