Chemical content 74AHCT164D

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Type numberPackagePackage descriptionTotal product weight
74AHCT164DSOT108-1SO14124.09931 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352654631181612601235Shanghai, China; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.6408080.100000.51636
PolymerResin systemProprietary0.1592019.900000.12828
DieDoped siliconSilicon (Si)7440-21-30.21155100.000000.17047
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.5653697.4700038.32846
Iron (Fe)7439-89-61.171202.400000.94376
Phosphorus (P)7723-14-00.014640.030000.01180
Zinc (Zn)7440-66-60.048800.100000.03932
Mould CompoundAdditiveNon hazardousProprietary3.478004.700002.80259
FillerSilica fused60676-86-058.4600079.0000047.10743
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.440006.000003.57778
PigmentCarbon black1333-86-40.148000.200000.11926
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.960004.000002.38519
Non hazardousProprietary3.034004.100002.44482
Tetramethylbiphenyl diglycidyl ether85954-11-61.480002.000001.19259
Pre-PlatingPure metal layerGold (Au)7440-57-50.002001.000000.00161
Nickel (Ni)7440-02-00.1940097.000000.15633
Palladium (Pd)7440-05-30.004002.000000.00322
WirePure metalCopper (Cu)7440-50-80.08776100.000000.07072
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.