Chemical content 74AHCT164PW

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Type numberPackagePackage descriptionTotal product weight
74AHCT164PWSOT402-1TSSOP1456.19299 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352654641181512601235Nijmegen, Netherlands; Suzhou, China; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.5126480.100000.91228
PolymerResin systemProprietary0.1273619.900000.22665
DieDoped siliconSilicon (Si)7440-21-30.21155100.000000.37646
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-820.4687097.4700036.42572
Iron (Fe)7439-89-60.504002.400000.89691
Phosphorus (P)7723-14-00.006300.030000.01121
Zinc (Zn)7440-66-60.021000.100000.03737
Mould CompoundAdditiveNon hazardousProprietary1.593304.700002.83541
FillerSilica fused60676-86-026.7810079.0000047.65897
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.034006.000003.61967
PigmentCarbon black1333-86-40.067800.200000.12066
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.356004.000002.41311
Non hazardousProprietary1.389904.100002.47344
Tetramethylbiphenyl diglycidyl ether85954-11-60.678002.000001.20656
Pre-PlatingPure metal layerGold (Au)7440-57-50.003501.000000.00623
Nickel (Ni)7440-02-00.3395097.000000.60417
Palladium (Pd)7440-05-30.007002.000000.01246
WirePure metalCopper (Cu)7440-50-80.09145100.000000.16274
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.