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Chemical content 74AHCT2G32DP-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT2G32DP-Q100SOT505-2TSSOP821.06220 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301452125412601235Ayutthaya, Thailand; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0198280.100000.09409
PolymerResin systemProprietary0.0049219.900000.02337
subTotal
DieDoped siliconSilicon (Si)7440-21-30.12590100.000000.59776
subTotal
Lead Frame MaterialCopper alloyIron (Fe)7439-89-60.209522.400000.99479
Copper (Cu)7440-50-88.5093097.4700040.40080
Phosphorus (P)7723-14-00.002620.030000.01243
Zinc (Zn)7440-66-60.008730.100000.04145
subTotal
Mould CompoundAdditiveNon hazardousProprietary0.565184.700002.68341
FillerSilica fused60676-86-09.4999179.0000045.10406
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.721516.000003.42563
PigmentCarbon black1333-86-40.024050.200000.11419
PolymerNon hazardousProprietary0.493034.100002.34084
1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.481014.000002.28375
Tetramethylbiphenyl diglycidyl ether85954-11-60.240502.000001.14188
subTotal
Pre-PlatingPure metal layerSilver (Ag)7440-22-40.001921.600000.00910
Gold (Au)7440-57-50.003603.000000.01707
Palladium (Pd)7440-05-30.003723.100000.01764
Nickel (Ni)7440-02-00.1106292.300000.52521
subTotal
WirePure metalCopper (Cu)7440-50-80.03634100.000000.17255
subTotal
total21.06220100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.