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Chemical content 74ALVC374PW

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Type numberPackagePackage descriptionTotal product weight
74ALVC374PWSOT360-1TSSOP2095.19478 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352697321181412601235Suzhou, China; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.6821080.100001.76701
PolymerResin systemProprietary0.4179019.900000.43899
subTotal2.10000100.000002.20600
DieDoped siliconSilicon (Si)7440-21-30.41381100.000000.43470
subTotal0.41381100.000000.43470
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-835.0892097.4700036.86042
Iron (Fe)7439-89-60.864002.400000.90761
Phosphorus (P)7723-14-00.010800.030000.01135
Zinc (Zn)7440-66-60.036000.100000.03782
subTotal36.00000100.0000037.81720
Mould CompoundFillerMisc. Silica compounds (generic)14808-60-748.6750088.5000051.13201
Flame retardantNon hazardousProprietary1.650003.000001.73329
PolymerEpoxy resin systemProprietary4.675008.500004.91098
subTotal55.00000100.0000057.77628
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.01576
Nickel (Ni)7440-02-01.4550097.000001.52845
Palladium (Pd)7440-05-30.030002.000000.03151
subTotal1.50000100.000001.57572
WirePure metalGold (Au)7440-57-50.1791699.000000.18821
Palladium (Pd)7440-05-30.001811.000000.00190
subTotal0.18097100.000000.19011
total95.19478100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.