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Chemical content 74ALVT16244DGG

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Type numberPackagePackage descriptionTotal product weight
74ALVT16244DGGSOT362-1TSSOP48204.69375 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352095701181612601235D-22529 HAMBURG, Germany; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2259177.900000.11036
PolymerAcrylic resinProprietary0.0440815.200000.02153
Resin systemProprietary0.020016.900000.00978
subTotal0.29000100.000000.14167
DieDoped siliconSilicon (Si)7440-21-31.60295100.000000.78310
subTotal1.60295100.000000.78310
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-876.6494097.0000037.44589
Nickel (Ni)7440-02-02.370603.000001.15812
subTotal79.02000100.0000038.60401
Mould CompoundAdditiveNon hazardousProprietary5.734004.700002.80126
FillerSilica fused60676-86-096.3800079.0000047.08497
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-87.320006.000003.57607
PigmentCarbon black1333-86-40.244000.200000.11920
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.880004.000002.38405
Non hazardousProprietary5.002004.100002.44365
Tetramethylbiphenyl diglycidyl ether85954-11-62.440002.000001.19202
subTotal122.00000100.0000059.60122
Pre-PlatingPure metal layerGold (Au)7440-57-50.015101.000000.00738
Nickel (Ni)7440-02-01.4647097.000000.71556
Palladium (Pd)7440-05-30.030202.000000.01475
subTotal1.51000100.000000.73769
WirePure metalCopper (Cu)7440-50-80.27081100.000000.13230
subTotal0.27081100.000000.13230
total204.69375100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.