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Chemical content 74AUP2G57GU-Q100

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Type numberPackagePackage descriptionTotal product weight
74AUP2G57GU-Q100SOT1160-1XQFN103.21021 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691244115612601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0055960.000000.17419
ImpurityNon hazardousProprietary0.000000.039500.00011
PolymerResin systemProprietary0.0037239.951410.11599
subTotal0.00932100.000000.29029
DieDoped siliconSilicon (Si)7440-21-30.09814100.000003.05711
subTotal0.09814100.000003.05711
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-81.5261397.0000047.53988
Nickel (Ni)7440-02-00.047203.000001.47031
subTotal1.57333100.0000049.01019
Mould CompoundAdditiveNon hazardousProprietary0.040392.900001.25820
FillerSilica fused60676-86-01.2388988.9500038.59208
PigmentCarbon black1333-86-40.002090.150000.06508
PolymerEpoxy resin systemProprietary0.020471.470000.63778
Phenolic resinProprietary0.043323.110001.34931
Tetramethylbiphenyl diglycidyl ether85954-11-60.047633.420001.48381
subTotal1.39279100.0000043.38626
Pre-PlatingPure metal layerGold (Au)7440-57-50.000851.000000.02634
Nickel (Ni)7440-02-00.0769591.000002.39703
Palladium (Pd)7440-05-30.006768.000000.21073
subTotal0.08456100.000002.63410
WirePure metalGold (Au)7440-57-50.0515599.000001.60573
Palladium (Pd)7440-05-30.000521.000000.01622
subTotal0.05207100.000001.62195
total3.21021100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.