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Chemical content 74AUP2G97GU

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Type numberPackagePackage descriptionTotal product weight
74AUP2G97GUSOT1160-1XQFN103.17749 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304484115812601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0055960.000000.17599
ImpurityNon hazardousProprietary0.000000.039500.00012
PolymerResin systemProprietary0.0037239.951410.11718
subTotal0.00932100.000000.29329
DieDoped siliconSilicon (Si)7440-21-30.06543100.000002.05906
subTotal0.06543100.000002.05906
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-81.5261397.0000048.02942
Nickel (Ni)7440-02-00.047203.000001.48545
subTotal1.57333100.0000049.51487
Mould CompoundAdditiveNon hazardousProprietary0.040392.900001.27116
FillerSilica fused60676-86-01.2388988.9500038.98948
PigmentCarbon black1333-86-40.002090.150000.06575
PolymerEpoxy resin systemProprietary0.020471.470000.64435
Phenolic resinProprietary0.043323.110001.36321
Tetramethylbiphenyl diglycidyl ether85954-11-60.047633.420001.49909
subTotal1.39279100.0000043.83304
Pre-PlatingPure metal layerGold (Au)7440-57-50.000851.000000.02661
Nickel (Ni)7440-02-00.0769591.000002.42171
Palladium (Pd)7440-05-30.006768.000000.21290
subTotal0.08456100.000002.66122
WirePure metalGold (Au)7440-57-50.0515599.000001.62227
Palladium (Pd)7440-05-30.000521.000000.01639
subTotal0.05207100.000001.63866
total3.17749100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.