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Chemical content 74AVC1T1022GU

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Type numberPackagePackage descriptionTotal product weight
74AVC1T1022GUSOT1160-1XQFN103.19875 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353058321151112601235Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0055960.000000.17482
ImpurityNon hazardousProprietary0.000000.039500.00012
PolymerResin systemProprietary0.0037239.951410.11640
subTotal0.00932100.000000.29134
DieDoped siliconSilicon (Si)7440-21-30.08880100.000002.77617
subTotal0.08880100.000002.77617
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-81.5261397.0000047.71020
Nickel (Ni)7440-02-00.047203.000001.47557
subTotal1.57333100.0000049.18577
Mould CompoundAdditiveNon hazardousProprietary0.040392.900001.26271
FillerSilica fused60676-86-01.2388988.9500038.73034
PigmentCarbon black1333-86-40.002090.150000.06531
PolymerEpoxy resin systemProprietary0.020471.470000.64006
Phenolic resinProprietary0.043323.110001.35415
Tetramethylbiphenyl diglycidyl ether85954-11-60.047633.420001.48913
subTotal1.39279100.0000043.54170
Pre-PlatingPure metal layerGold (Au)7440-57-50.000851.000000.02644
Nickel (Ni)7440-02-00.0769591.000002.40561
Palladium (Pd)7440-05-30.006768.000000.21148
subTotal0.08456100.000002.64353
WirePure metalGold (Au)7440-57-50.0494499.000001.54575
Palladium (Pd)7440-05-30.000501.000000.01561
subTotal0.04994100.000001.56136
total3.19875100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.