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Chemical content 74CBTLV3245BQ

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Type numberPackagePackage descriptionTotal product weight
74CBTLV3245BQSOT764-1DHVQFN2028.35729 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352938221151112601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24089
PolymerResin systemProprietary0.0169719.900000.05985
subTotal0.08528100.000000.30074
DieDoped siliconSilicon (Si)7440-21-30.68114100.000002.40199
subTotal0.68114100.000002.40199
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.34193
Iron (Fe)7439-89-60.260742.400000.91947
Phosphorus (P)7723-14-00.003260.030000.01149
Zinc (Zn)7440-66-60.010860.100000.03831
subTotal10.86402100.0000038.31120
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.68038
FillerSilica -amorphous-7631-86-90.571483.490002.01530
Silica fused60676-86-013.8892084.8200048.97929
PigmentCarbon black1333-86-40.026200.160000.09239
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62365
Epoxy resin systemProprietary0.260361.590000.91815
Phenolic resinProprietary0.368442.250001.29926
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13656
subTotal16.37491100.0000057.74498
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00972
Nickel (Ni)7440-02-00.2509591.000000.88496
Palladium (Pd)7440-05-30.022068.000000.07780
subTotal0.27577100.000000.97248
WirePure metalCopper (Cu)7440-50-80.0735496.550000.25934
Pure metal layerGold (Au)7440-57-50.000270.350000.00094
Palladium (Pd)7440-05-30.002363.100000.00833
subTotal0.07617100.000000.26861
total28.35729100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.