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Chemical content 74HC123D

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Type numberPackagePackage descriptionTotal product weight
74HC123DSOT109-1SO16143.06197 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337139606531412601235Nijmegen, Netherlands; Bangkok, Thailand; Shanghai, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01634
PolymerAcrylic resinProprietary0.0045615.200000.00319
Resin systemProprietary0.002076.900000.00145
subTotal0.03000100.000000.02098
DieDoped siliconSilicon (Si)7440-21-30.41898100.000000.29287
subTotal0.41898100.000000.29287
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.66847
Iron (Fe)7439-89-60.904202.400000.63203
Phosphorus (P)7723-14-00.011300.030000.00790
Zinc (Zn)7440-66-60.037680.100000.02633
subTotal37.67500100.0000026.33473
Mould CompoundAdditiveNon hazardousProprietary4.900694.700003.42557
FillerSilica fused60676-86-082.3733079.0000057.57875
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.256206.000004.37307
PigmentCarbon black1333-86-40.208540.200000.14577
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.170804.000002.91538
Non hazardousProprietary4.275074.100002.98826
Tetramethylbiphenyl diglycidyl ether85954-11-62.085402.000001.45769
subTotal104.27000100.0000072.88449
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00395
Nickel (Ni)7440-02-00.5480597.000000.38309
Palladium (Pd)7440-05-30.011302.000000.00790
subTotal0.56500100.000000.39494
WirePure metalCopper (Cu)7440-50-80.10299100.000000.07199
subTotal0.10299100.000000.07199
total143.06197100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.