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Chemical content 74HC166PW

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Type numberPackagePackage descriptionTotal product weight
74HC166PWSOT403-1TSSOP1653.71761 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351889601181412601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.21753
PolymerAcrylic resinProprietary0.0228015.200000.04244
Resin systemProprietary0.010356.900000.01927
subTotal0.15000100.000000.27924
DieDoped siliconSilicon (Si)7440-21-31.09010100.000002.02932
subTotal1.09010100.000002.02932
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.03372
Iron (Fe)7439-89-60.489842.400000.91188
Phosphorus (P)7723-14-00.006120.030000.01140
Zinc (Zn)7440-66-60.020410.100000.03799
subTotal20.41000100.0000037.99499
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.77183
FillerSilica fused60676-86-025.0272079.0000046.59031
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.53850
PigmentCarbon black1333-86-40.063360.200000.11795
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.35900
Non hazardousProprietary1.298884.100002.41798
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.17950
subTotal31.68000100.0000058.97507
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00558
Nickel (Ni)7440-02-00.2910097.000000.54172
Palladium (Pd)7440-05-30.006002.000000.01117
subTotal0.30000100.000000.55847
WirePure metalCopper (Cu)7440-50-80.08750100.000000.16289
subTotal0.08750100.000000.16289
total53.71761100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.