Chemical content 74HC2G66DC-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC2G66DC-Q100SOT765-1VSSOP810.03077 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300855125612601235Suzhou, China; Nijmegen, Netherlands; Ayutthaya, Thailand; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000361.000000.00357
FillerSilver (Ag)7440-22-40.0268875.000000.26798
PolymerAcrylic resinProprietary0.002156.000000.02144
Resin systemProprietary0.0064518.000000.06431
DieDoped siliconSilicon (Si)7440-21-30.18039100.000001.79835
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000033.88125
Nickel (Ni)7440-02-00.105113.000001.04787
Mould CompoundFillerSilica -amorphous-7631-86-90.037090.600000.36980
Silica fused60676-86-04.8426078.3300048.27741
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.377126.100003.75963
PigmentCarbon black1333-86-40.012360.200000.12327
PolymerEpoxy resin systemProprietary0.547888.862005.46195
Phenolic resinProprietary0.365255.908003.64130
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03079
Nickel (Ni)7440-02-00.0950292.300000.94731
Palladium (Pd)7440-05-30.003193.100000.03182
Silver (Ag)7440-22-40.001651.600000.01642
WirePure metalCopper (Cu)7440-50-80.02563100.000000.25553
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.