Chemical content 74HC3GU04DP

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Type numberPackagePackage descriptionTotal product weight
74HC3GU04DPSOT505-2TSSOP821.06432 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352726911251112601235Ayutthaya, Thailand; Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000251.000000.00117
FillerSilver (Ag)7440-22-40.0185675.000000.08809
PolymerAcrylic resinProprietary0.001486.000000.00705
Resin systemProprietary0.0044518.000000.02114
DieDoped siliconSilicon (Si)7440-21-30.12862100.000000.61059
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.5093097.4700040.39673
Iron (Fe)7439-89-60.209522.400000.99469
Phosphorus (P)7723-14-00.002620.030000.01243
Zinc (Zn)7440-66-60.008730.100000.04145
Mould CompoundFillerSilica -amorphous-7631-86-90.072150.600000.34253
Silica fused60676-86-09.4193478.3300044.71703
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.733546.100003.48237
PigmentCarbon black1333-86-40.024050.200000.11418
PolymerEpoxy resin systemProprietary1.065678.862005.05914
Phenolic resinProprietary0.710455.908003.37276
Pre-PlatingPure metal layerGold (Au)7440-57-50.003603.000000.01707
Nickel (Ni)7440-02-00.1106292.300000.52516
Palladium (Pd)7440-05-30.003723.100000.01764
Silver (Ag)7440-22-40.001921.600000.00910
WirePure metalCopper (Cu)7440-50-80.03574100.000000.16969
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.