Chemical content 74HC4053BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4053BQ-Q100SOT763-1DHVQFN1621.49835 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298851115912601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13955
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09292
DieDoped siliconSilicon (Si)7440-21-30.48953100.000002.27707
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.41485
Iron (Fe)7439-89-60.198062.400000.92126
Phosphorus (P)7723-14-00.002480.030000.01152
Zinc (Zn)7440-66-60.008250.100000.03839
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.68366
FillerSilica -amorphous-7631-86-90.434103.490002.01924
Silica fused60676-86-010.5503084.8200049.07494
PigmentCarbon black1333-86-40.019900.160000.09257
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62486
Epoxy resin systemProprietary0.197771.590000.91994
Phenolic resinProprietary0.279872.250001.30180
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.14074
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00974
Nickel (Ni)7440-02-00.1906391.000000.88670
Palladium (Pd)7440-05-30.016768.000000.07795
WirePure metalCopper (Cu)7440-50-80.0565096.550000.26279
Pure metal layerGold (Au)7440-57-50.000200.350000.00095
Palladium (Pd)7440-05-30.001813.100000.00844
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.