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Chemical content 74HC573D

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Type numberPackagePackage descriptionTotal product weight
74HC573DSOT163-1SO20511.68464 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337135606531312601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-410.4130080.100002.03504
PolymerResin systemProprietary2.5870019.900000.50558
subTotal13.00000100.000002.54062
DieDoped siliconSilicon (Si)7440-21-30.31140100.000000.06086
subTotal0.31140100.000000.06086
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8151.0785097.4700029.52571
Iron (Fe)7439-89-63.720002.400000.72701
Phosphorus (P)7723-14-00.046500.030000.00909
Zinc (Zn)7440-66-60.155000.100000.03029
subTotal155.00000100.0000030.29210
Mould CompoundAdditiveNon hazardousProprietary15.980004.700003.12302
FillerSilica fused60676-86-0268.6000079.0000052.49327
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-820.400006.000003.98683
PigmentCarbon black1333-86-40.680000.200000.13289
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-613.600004.000002.65789
Non hazardousProprietary13.940004.100002.72433
Tetramethylbiphenyl diglycidyl ether85954-11-66.800002.000001.32894
subTotal340.00000100.0000066.44717
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.00625
Nickel (Ni)7440-02-03.1040097.000000.60662
Palladium (Pd)7440-05-30.064002.000000.01251
subTotal3.20000100.000000.62538
WirePure metalCopper (Cu)7440-50-80.17323100.000000.03386
subTotal0.17323100.000000.03386
total511.68464100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.