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Chemical content 74HC574PW

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Type numberPackagePackage descriptionTotal product weight
74HC574PWSOT360-1TSSOP2068.77379 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351870201181212601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0623277.900000.09062
PolymerAcrylic resinProprietary0.0121615.200000.01768
Resin systemProprietary0.005526.900000.00803
subTotal0.08000100.000000.11633
DieDoped siliconSilicon (Si)7440-21-30.31539100.000000.45859
subTotal0.31539100.000000.45859
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.8258297.4700043.36800
Iron (Fe)7439-89-60.734402.400001.06785
Phosphorus (P)7723-14-00.009180.030000.01335
Zinc (Zn)7440-66-60.030600.100000.04449
subTotal30.60000100.0000044.49369
Mould CompoundAdditiveNon hazardousProprietary1.747464.700002.54088
FillerSilica fused60676-86-029.3722079.0000042.70842
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.230806.000003.24368
PigmentCarbon black1333-86-40.074360.200000.10812
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.487204.000002.16245
Non hazardousProprietary1.524384.100002.21651
Tetramethylbiphenyl diglycidyl ether85954-11-60.743602.000001.08123
subTotal37.18000100.0000054.06129
Pre-PlatingPure metal layerGold (Au)7440-57-50.004601.000000.00669
Nickel (Ni)7440-02-00.4462097.000000.64879
Palladium (Pd)7440-05-30.009202.000000.01338
subTotal0.46000100.000000.66886
WirePure metalCopper (Cu)7440-50-80.13840100.000000.20124
subTotal0.13840100.000000.20124
total68.77379100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.