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Chemical content 74HC73D

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Type numberPackagePackage descriptionTotal product weight
74HC73DSOT108-1SO14123.80057 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337144306531712601235Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06292
PolymerAcrylic resinProprietary0.0152015.200000.01228
Resin systemProprietary0.006906.900000.00557
subTotal0.10000100.000000.08077
DieDoped siliconSilicon (Si)7440-21-30.83664100.000000.67580
subTotal0.83664100.000000.67580
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.06699
Iron (Fe)7439-89-61.068962.400000.86345
Phosphorus (P)7723-14-00.013360.030000.01079
Zinc (Zn)7440-66-60.044540.100000.03598
subTotal44.54000100.0000035.97721
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.94565
FillerSilica fused60676-86-061.2961079.0000049.51197
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.76040
PigmentCarbon black1333-86-40.155180.200000.12535
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.50694
Non hazardousProprietary3.181194.100002.56961
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25347
subTotal77.59000100.0000062.67339
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00541
Nickel (Ni)7440-02-00.6499097.000000.52496
Palladium (Pd)7440-05-30.013402.000000.01082
subTotal0.67000100.000000.54119
WirePure metalCopper (Cu)7440-50-80.06393100.000000.05164
subTotal0.06393100.000000.05164
total123.80057100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.