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Chemical content 74HC73PW

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Type numberPackagePackage descriptionTotal product weight
74HC73PWSOT402-1TSSOP1452.44881 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352420701181412601235Suzhou, China; Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.05941
PolymerAcrylic resinProprietary0.0060815.200000.01159
Resin systemProprietary0.002766.900000.00526
subTotal0.04000100.000000.07626
DieDoped siliconSilicon (Si)7440-21-30.83664100.000001.59516
subTotal0.83664100.000001.59516
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.31281
Iron (Fe)7439-89-60.468962.400000.89413
Phosphorus (P)7723-14-00.005860.030000.01118
Zinc (Zn)7440-66-60.019540.100000.03726
subTotal19.54000100.0000037.25538
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.83888
FillerSilica fused60676-86-025.0272079.0000047.71738
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.62411
PigmentCarbon black1333-86-40.063360.200000.12080
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.41607
Non hazardousProprietary1.298884.100002.47647
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.20804
subTotal31.68000100.0000060.40175
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00553
Nickel (Ni)7440-02-00.2813097.000000.53633
Palladium (Pd)7440-05-30.005802.000000.01106
subTotal0.29000100.000000.55292
WirePure metalCopper (Cu)7440-50-80.06217100.000000.11853
subTotal0.06217100.000000.11853
total52.44881100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.