Chemical content 74HCT132PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT132PW-Q100SOT402-1TSSOP1459.66407 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298741118812601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02611
PolymerAcrylic resinProprietary0.0030415.200000.00510
Resin systemProprietary0.001386.900000.00231
DieDoped siliconSilicon (Si)7440-21-30.19791100.000000.33171
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.47777
Iron (Fe)7439-89-60.462442.400000.77508
Phosphorus (P)7723-14-00.005780.030000.00969
Zinc (Zn)7440-66-60.019270.100000.03229
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39823
Silica fused60676-86-031.0186878.3300051.98888
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.04867
PigmentCarbon black1333-86-40.079200.200000.13274
PolymerEpoxy resin systemProprietary3.509358.862005.88185
Phenolic resinProprietary2.339575.908003.92123
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02459
Nickel (Ni)7440-02-00.4514692.300000.75667
Palladium (Pd)7440-05-30.015163.100000.02541
Silver (Ag)7440-22-40.007831.600000.01312
WirePure metalCopper (Cu)7440-50-80.08863100.000000.14854
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.