Chemical content 74HCT151D

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Type number	Package	Package description	Total product weight
74HCT151D	SOT109-1	SO16	142.42491 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
933713710653	12	1	260		1	235			Suzhou, China; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silver (Ag)	7440-22-4	2.00250	80.10000	1.40600
	Polymer	Resin system	Proprietary	0.49750	19.90000	0.34931
		subTotal		2.50000	100.00000	1.75531

Die	Doped silicon	Silicon (Si)	7440-21-3	0.50373	100.00000	0.35368
		subTotal		0.50373	100.00000	0.35368

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	69.20370	97.47000	48.58960
		Iron (Fe)	7439-89-6	1.70400	2.40000	1.19642
		Phosphorus (P)	7723-14-0	0.02130	0.03000	0.01496
		Zinc (Zn)	7440-66-6	0.07100	0.10000	0.04985
		subTotal		71.00000	100.00000	49.85083

Mould Compound	Additive	Non hazardous	Proprietary	3.19600	4.70000	2.24399
	Filler	Silica fused	60676-86-0	53.72000	79.00000	37.71812
	Flame retardant	Magnesium Hydroxide (Mg(OH)2)	1309-42-8	4.08000	6.00000	2.86467
	Pigment	Carbon black	1333-86-4	0.13600	0.20000	0.09549
	Polymer	1,4-Bis(methoxymethyl)benzene/phenol copolymer	26834-02-6	2.72000	4.00000	1.90978
		Non hazardous	Proprietary	2.78800	4.10000	1.95752
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	1.36000	2.00000	0.95489
		subTotal		68.00000	100.00000	47.74446

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.00300	1.00000	0.00211
		Nickel (Ni)	7440-02-0	0.29100	97.00000	0.20432
		Palladium (Pd)	7440-05-3	0.00600	2.00000	0.00421
		subTotal		0.30000	100.00000	0.21064

Wire	Pure metal	Copper (Cu)	7440-50-8	0.12117	100.00000	0.08508
		subTotal		0.12117	100.00000	0.08508

		total		142.42491	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.