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Chemical content 74HCT157PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT157PW-Q100SOT403-1TSSOP1667.18563 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298909118712601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.3895077.900000.57974
PolymerAcrylic resinProprietary0.0760015.200000.11312
Resin systemProprietary0.034506.900000.05135
subTotal0.50000100.000000.74421
DieDoped siliconSilicon (Si)7440-21-30.45756100.000000.68104
subTotal0.45756100.000000.68104
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700055.12875
Iron (Fe)7439-89-60.912002.400001.35743
Phosphorus (P)7723-14-00.011400.030000.01697
Zinc (Zn)7440-66-60.038000.100000.05656
subTotal38.00000100.0000056.55971
Mould CompoundAdditiveNon hazardousProprietary1.251094.700001.86214
FillerSilica fused60676-86-021.0290179.0000031.29986
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.597146.000002.37720
PigmentCarbon black1333-86-40.053240.200000.07924
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.064764.000001.58480
Non hazardousProprietary1.091384.100001.62442
Tetramethylbiphenyl diglycidyl ether85954-11-60.532382.000000.79240
subTotal26.61900100.0000039.62006
Pre-PlatingPure metal layerGold (Au)7440-57-50.045003.000000.06698
Nickel (Ni)7440-02-01.3845092.300002.06071
Palladium (Pd)7440-05-30.046503.100000.06921
Silver (Ag)7440-22-40.024001.600000.03572
subTotal1.50000100.000002.23262
WirePure metalCopper (Cu)7440-50-80.10907100.000000.16234
subTotal0.10907100.000000.16234
total67.18563100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.