Chemical content 74HCT157PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT157PW-Q100SOT403-1TSSOP1660.52336 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298909118812601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21881
PolymerAcrylic resinProprietary0.0258415.200000.04269
Resin systemProprietary0.011736.900000.01938
DieDoped siliconSilicon (Si)7440-21-30.32683100.000000.54000
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.91028
Iron (Fe)7439-89-60.475552.400000.78573
Phosphorus (P)7723-14-00.005940.030000.00982
Zinc (Zn)7440-66-60.019810.100000.03274
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39258
Silica fused60676-86-031.0186878.3300051.25076
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.99119
PigmentCarbon black1333-86-40.079200.200000.13086
PolymerEpoxy resin systemProprietary3.509358.862005.79834
Phenolic resinProprietary2.339575.908003.86556
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02493
Nickel (Ni)7440-02-00.4642592.300000.76706
Palladium (Pd)7440-05-30.015593.100000.02576
Silver (Ag)7440-22-40.008051.600000.01330
WirePure metalCopper (Cu)7440-50-80.10907100.000000.18022
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.