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Chemical content 74HCT238PW

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Type numberPackagePackage descriptionTotal product weight
74HCT238PWSOT403-1TSSOP1652.89167 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351895601181112601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.22092
PolymerAcrylic resinProprietary0.0228015.200000.04311
Resin systemProprietary0.010356.900000.01957
subTotal0.15000100.000000.28360
DieDoped siliconSilicon (Si)7440-21-30.23745100.000000.44894
subTotal0.23745100.000000.44894
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.61202
Iron (Fe)7439-89-60.489842.400000.92612
Phosphorus (P)7723-14-00.006120.030000.01158
Zinc (Zn)7440-66-60.020410.100000.03859
subTotal20.41000100.0000038.58831
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.81511
FillerSilica fused60676-86-025.0272079.0000047.31785
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.59376
PigmentCarbon black1333-86-40.063360.200000.11979
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.39584
Non hazardousProprietary1.298884.100002.45574
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.19792
subTotal31.68000100.0000059.89601
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00567
Nickel (Ni)7440-02-00.2910097.000000.55018
Palladium (Pd)7440-05-30.006002.000000.01134
subTotal0.30000100.000000.56719
WirePure metalCopper (Cu)7440-50-80.11422100.000000.21595
subTotal0.11422100.000000.21595
total52.89167100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.