Chemical content 74HCT2G02DP-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT2G02DP-Q100SOT505-2TSSOP821.06646 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300845125612601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000251.000000.00117
FillerSilver (Ag)7440-22-40.0185675.000000.08808
PolymerAcrylic resinProprietary0.001486.000000.00705
Resin systemProprietary0.0044518.000000.02114
DieDoped siliconSilicon (Si)7440-21-30.13079100.000000.62087
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.5093097.4700040.39263
Iron (Fe)7439-89-60.209522.400000.99459
Phosphorus (P)7723-14-00.002620.030000.01243
Zinc (Zn)7440-66-60.008730.100000.04144
Mould CompoundFillerSilica -amorphous-7631-86-90.072150.600000.34249
Silica fused60676-86-09.4193478.3300044.71249
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.733546.100003.48201
PigmentCarbon black1333-86-40.024050.200000.11416
PolymerEpoxy resin systemProprietary1.065678.862005.05863
Phenolic resinProprietary0.710455.908003.37242
Pre-PlatingPure metal layerGold (Au)7440-57-50.003603.000000.01707
Nickel (Ni)7440-02-00.1106292.300000.52511
Palladium (Pd)7440-05-30.003723.100000.01764
Silver (Ag)7440-22-40.001921.600000.00910
WirePure metalCopper (Cu)7440-50-80.03571100.000000.16950
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.