Chemical content 74HCT374D

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Type numberPackagePackage descriptionTotal product weight
74HCT374DSOT163-1SO20511.71232 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337134906531312601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.130001.000000.02540
FillerSilver (Ag)7440-22-49.7500075.000001.90537
PolymerAcrylic resinProprietary0.780006.000000.15243
Resin systemProprietary2.3400018.000000.45729
DieDoped siliconSilicon (Si)7440-21-30.34167100.000000.06677
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8151.0785097.4700029.52411
Iron (Fe)7439-89-63.720002.400000.72697
Phosphorus (P)7723-14-00.046500.030000.00909
Zinc (Zn)7440-66-60.155000.100000.03029
Mould CompoundFillerSilica -amorphous-7631-86-92.040000.600000.39866
Silica fused60676-86-0266.3220078.3300052.04526
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-820.740006.100004.05306
PigmentCarbon black1333-86-40.680000.200000.13289
PolymerEpoxy resin systemProprietary30.130808.862005.88823
Phenolic resinProprietary20.087205.908003.92549
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.00625
Nickel (Ni)7440-02-03.1040097.000000.60659
Palladium (Pd)7440-05-30.064002.000000.01251
WirePure metalCopper (Cu)7440-50-80.17065100.000000.03335
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.