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Chemical content 74HCT597PW

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Type numberPackagePackage descriptionTotal product weight
74HCT597PWSOT403-1TSSOP1661.58780 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691212118312601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21503
PolymerAcrylic resinProprietary0.0258415.200000.04196
Resin systemProprietary0.011736.900000.01905
subTotal0.17000100.000000.27604
DieDoped siliconSilicon (Si)7440-21-31.49734100.000002.43123
subTotal1.49734100.000002.43123
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.35877
Iron (Fe)7439-89-60.475552.400000.77215
Phosphorus (P)7723-14-00.005940.030000.00965
Zinc (Zn)7440-66-60.019810.100000.03217
subTotal19.81448100.0000032.17274
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.02203
FillerSilica fused60676-86-031.2840079.0000050.79577
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.85791
PigmentCarbon black1333-86-40.079200.200000.12860
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.57194
Non hazardousProprietary1.623604.100002.63624
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.28597
subTotal39.60000100.0000064.29846
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02450
Nickel (Ni)7440-02-00.4642592.300000.75380
Palladium (Pd)7440-05-30.015593.100000.02532
Silver (Ag)7440-22-40.008051.600000.01307
subTotal0.50298100.000000.81669
WirePure metalCopper (Cu)7440-50-80.00300100.000000.00487
subTotal0.00300100.000000.00487
total61.58780100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.