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Chemical content 74HCT74BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT74BQSOT762-1DHVQFN1417.96637 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736151151612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10370
PolymerResin systemProprietary0.0046319.900000.02576
subTotal0.02326100.000000.12946
DieDoped siliconSilicon (Si)7440-21-30.21261100.000001.18339
subTotal0.21261100.000001.18339
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.86503
Iron (Fe)7439-89-60.167512.400000.93235
Phosphorus (P)7723-14-00.002090.030000.01165
Zinc (Zn)7440-66-60.006980.100000.03885
subTotal6.97956100.0000038.84788
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70392
FillerSilica -amorphous-7631-86-90.367153.490002.04353
Silica fused60676-86-08.9230684.8200049.66537
PigmentCarbon black1333-86-40.016830.160000.09369
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63238
Epoxy resin systemProprietary0.167271.590000.93101
Phenolic resinProprietary0.236702.250001.31746
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16649
subTotal10.52000100.0000058.55385
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00986
Nickel (Ni)7440-02-00.1612391.000000.89740
Palladium (Pd)7440-05-30.014178.000000.07889
subTotal0.17718100.000000.98615
WirePure metalCopper (Cu)7440-50-80.0519196.550000.28895
Pure metal layerGold (Au)7440-57-50.000190.350000.00105
Palladium (Pd)7440-05-30.001673.100000.00928
subTotal0.05377100.000000.29928
total17.96637100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.