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Chemical content 74LV164BQ

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Type numberPackagePackage descriptionTotal product weight
74LV164BQSOT762-1DHVQFN1418.52100 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352786541151712601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10060
PolymerResin systemProprietary0.0046319.900000.02499
subTotal0.02326100.000000.12559
DieDoped siliconSilicon (Si)7440-21-30.77660100.000004.19309
subTotal0.77660100.000004.19309
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700036.73113
Iron (Fe)7439-89-60.167512.400000.90443
Phosphorus (P)7723-14-00.002090.030000.01131
Zinc (Zn)7440-66-60.006980.100000.03768
subTotal6.97956100.0000037.68455
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.65289
FillerSilica -amorphous-7631-86-90.367153.490001.98233
Silica fused60676-86-08.9230684.8200048.17809
PigmentCarbon black1333-86-40.016830.160000.09088
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.61344
Epoxy resin systemProprietary0.167271.590000.90313
Phenolic resinProprietary0.236702.250001.27801
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.10161
subTotal10.52000100.0000056.80038
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00957
Nickel (Ni)7440-02-00.1612391.000000.87053
Palladium (Pd)7440-05-30.014178.000000.07653
subTotal0.17718100.000000.95663
WirePure metalCopper (Cu)7440-50-80.0428796.550000.23148
Pure metal layerGold (Au)7440-57-50.000160.350000.00084
Palladium (Pd)7440-05-30.001383.100000.00743
subTotal0.04441100.000000.23975
total18.52100100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.