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Chemical content 74LV164D

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Type numberPackagePackage descriptionTotal product weight
74LV164DSOT108-1SO14123.74937 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9350674501181212601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06295
PolymerAcrylic resinProprietary0.0152015.200000.01228
Resin systemProprietary0.006906.900000.00558
subTotal0.10000100.000000.08081
DieDoped siliconSilicon (Si)7440-21-30.77660100.000000.62756
subTotal0.77660100.000000.62756
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.08150
Iron (Fe)7439-89-61.068962.400000.86381
Phosphorus (P)7723-14-00.013360.030000.01080
Zinc (Zn)7440-66-60.044540.100000.03599
subTotal44.54000100.0000035.99210
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.94687
FillerSilica fused60676-86-061.2961079.0000049.53245
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.76196
PigmentCarbon black1333-86-40.155180.200000.12540
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.50797
Non hazardousProprietary3.181194.100002.57067
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25399
subTotal77.59000100.0000062.69931
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00541
Nickel (Ni)7440-02-00.6499097.000000.52517
Palladium (Pd)7440-05-30.013402.000000.01083
subTotal0.67000100.000000.54141
WirePure metalCopper (Cu)7440-50-80.07277100.000000.05880
subTotal0.07277100.000000.05880
total123.74937100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.