Chemical content 74LV4052PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV4052PW-Q100SOT403-1TSSOP1661.06261 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301549118812601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21688
PolymerAcrylic resinProprietary0.0258415.200000.04232
Resin systemProprietary0.011736.900000.01921
DieDoped siliconSilicon (Si)7440-21-30.88515100.000001.44958
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.62848
Iron (Fe)7439-89-60.475552.400000.77879
Phosphorus (P)7723-14-00.005940.030000.00973
Zinc (Zn)7440-66-60.019810.100000.03245
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.38911
Silica fused60676-86-031.0186878.3300050.79816
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.95594
PigmentCarbon black1333-86-40.079200.200000.12970
PolymerEpoxy resin systemProprietary3.509358.862005.74714
Phenolic resinProprietary2.339575.908003.83142
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02471
Nickel (Ni)7440-02-00.4642592.300000.76029
Palladium (Pd)7440-05-30.015593.100000.02554
Silver (Ag)7440-22-40.008051.600000.01318
WirePure metalCopper (Cu)7440-50-80.09000100.000000.14740
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.