Chemical content 74LV4053PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV4053PW-Q100SOT403-1TSSOP1660.79156 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300909118712601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21784
PolymerAcrylic resinProprietary0.0258415.200000.04251
Resin systemProprietary0.011736.900000.01930
DieDoped siliconSilicon (Si)7440-21-30.60395100.000000.99347
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.76950
Iron (Fe)7439-89-60.475552.400000.78226
Phosphorus (P)7723-14-00.005940.030000.00978
Zinc (Zn)7440-66-60.019810.100000.03259
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39084
Silica fused60676-86-031.0186878.3300051.02465
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.97358
PigmentCarbon black1333-86-40.079200.200000.13028
PolymerEpoxy resin systemProprietary3.509358.862005.77276
Phenolic resinProprietary2.339575.908003.84851
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02482
Nickel (Ni)7440-02-00.4642592.300000.76368
Palladium (Pd)7440-05-30.015593.100000.02565
Silver (Ag)7440-22-40.008051.600000.01324
WirePure metalCopper (Cu)7440-50-80.10015100.000000.16475
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.