Chemical content 74LV74D

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Type numberPackagePackage descriptionTotal product weight
74LV74DSOT108-1SO14136.55015 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9350633001181112601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.46649
PolymerResin systemProprietary0.4975019.900000.36434
DieDoped siliconSilicon (Si)7440-21-30.67829100.000000.49673
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-863.3555097.4700046.39724
Iron (Fe)7439-89-61.560002.400001.14244
Phosphorus (P)7723-14-00.019500.030000.01428
Zinc (Zn)7440-66-60.065000.100000.04760
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.34053
FillerSilica fused60676-86-053.7200079.0000039.34086
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.98791
PigmentCarbon black1333-86-40.136000.200000.09960
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.99194
Non hazardousProprietary2.788004.100002.04174
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.99597
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00220
Nickel (Ni)7440-02-00.2910097.000000.21311
Palladium (Pd)7440-05-30.006002.000000.00439
WirePure metalCopper (Cu)7440-50-80.07186100.000000.05262
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.