Chemical content 74LVC14ABZ

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Type number	Package	Package description	Total product weight
74LVC14ABZ	SOT8014-1	DHXQFN14	5.51675 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
935691141147	6	1	260		1	235			Suzhou, China; Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Adhesive	Filler	Silica -amorphous-	7631-86-9	0.00671	60.00000	0.12159
	Impurity	Non hazardous	Proprietary	0.00000	0.03950	0.00008
	Polymer	Resin system	Proprietary	0.00447	39.95141	0.08096
		subTotal		0.01118	100.00000	0.20263

Die	Doped silicon	Silicon (Si)	7440-21-3	0.08392	100.00000	1.52122
		subTotal		0.08392	100.00000	1.52122

Lead Frame Material	Copper alloy	Copper (Cu)	7440-50-8	2.69450	97.00000	48.84225
		Nickel (Ni)	7440-02-0	0.08334	3.00000	1.51059
		subTotal		2.77784	100.00000	50.35284

Mould Compound	Additive	Non hazardous	Proprietary	0.07614	2.90000	1.38024
	Filler	Silica fused	60676-86-0	2.33552	88.95000	42.33515
	Pigment	Carbon black	1333-86-4	0.00394	0.15000	0.07139
	Polymer	Epoxy resin system	Proprietary	0.03860	1.47000	0.69964
		Phenolic resin	Proprietary	0.08166	3.11000	1.48018
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	0.08980	3.42000	1.62773
		subTotal		2.62566	100.00000	47.59433

Pre-Plating	Pure metal layer	Gold (Au)	7440-57-5	0.00014	1.00000	0.00249
		Nickel (Ni)	7440-02-0	0.01249	91.00000	0.22631
		Palladium (Pd)	7440-05-3	0.00110	8.00000	0.01990
		subTotal		0.01372	100.00000	0.24870

Wire	Pure metal	Copper (Cu)	7440-50-8	0.00428	96.55000	0.07758
	Pure metal layer	Gold (Au)	7440-57-5	0.00002	0.35000	0.00028
		Palladium (Pd)	7440-05-3	0.00014	3.10000	0.00249
		subTotal		0.00443	100.00000	0.08035

		total		5.51675	100.00000	100.00000

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.