Chemical content 74LVC16373ADGV-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC16373ADGV-Q100SOT480-1TSSOP48115.09816 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935690793118612601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.9581777.900000.83248
PolymerAcrylic resinProprietary0.1869615.200000.16244
Resin systemProprietary0.084876.900000.07374
DieDoped siliconSilicon (Si)7440-21-31.19239100.000001.03598
Lead FrameCopper alloyCopper (Cu)7440-50-845.9683194.5850039.93835
Magnesium (Mg)7439-95-40.083590.172000.07263
Silicon (Si)7440-21-30.346280.712500.30085
ImpurityNon hazardousProprietary0.000000.000000.00000
Pure metal layerGold (Au)7440-57-50.014340.029500.01246
Nickel (Ni)7440-02-02.153014.430061.87059
Palladium (Pd)7440-05-30.023810.049000.02069
Silver (Ag)7440-22-40.010450.021500.00908
Mould CompoundFillerSilica -amorphous-7631-86-90.383100.600000.33285
Silica fused60676-86-050.0137078.3300043.45309
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.894856.100003.38394
PigmentCarbon black1333-86-40.127700.200000.11095
PolymerEpoxy resin systemProprietary5.658398.862004.91614
Phenolic resinProprietary3.772265.908003.27743
WirePure metalCopper (Cu)7440-50-80.22577100.000000.19615
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.