Chemical content 74LVC1G53DP-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G53DP-Q100SOT505-2TSSOP821.08000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300247125712601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000251.000000.00117
FillerSilver (Ag)7440-22-40.0185675.000000.08802
PolymerAcrylic resinProprietary0.001486.000000.00704
Resin systemProprietary0.0044518.000000.02113
DieDoped siliconSilicon (Si)7440-21-30.13543100.000000.64246
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.5093097.4700040.36668
Iron (Fe)7439-89-60.209522.400000.99395
Phosphorus (P)7723-14-00.002620.030000.01242
Zinc (Zn)7440-66-60.008730.100000.04141
Mould CompoundFillerSilica -amorphous-7631-86-90.072150.600000.34227
Silica fused60676-86-09.4193478.3300044.68377
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.733546.100003.47978
PigmentCarbon black1333-86-40.024050.200000.11409
PolymerEpoxy resin systemProprietary1.065678.862005.05538
Phenolic resinProprietary0.710455.908003.37025
Pre-PlatingPure metal layerGold (Au)7440-57-50.003603.000000.01706
Nickel (Ni)7440-02-00.1106292.300000.52477
Palladium (Pd)7440-05-30.003723.100000.01762
Silver (Ag)7440-22-40.001921.600000.00910
WirePure metalCopper (Cu)7440-50-80.04461100.000000.21160
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.