Chemical content 74LVC1G74DP-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC1G74DP-Q100SOT505-2TSSOP821.05765 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935299294125912601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000251.000000.00117
FillerSilver (Ag)7440-22-40.0185675.000000.08812
PolymerAcrylic resinProprietary0.001486.000000.00705
Resin systemProprietary0.0044518.000000.02115
DieDoped siliconSilicon (Si)7440-21-30.11941100.000000.56707
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.5093097.4700040.40953
Iron (Fe)7439-89-60.209522.400000.99500
Phosphorus (P)7723-14-00.002620.030000.01244
Zinc (Zn)7440-66-60.008730.100000.04146
Mould CompoundFillerSilica -amorphous-7631-86-90.072150.600000.34264
Silica fused60676-86-09.4193478.3300044.73120
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.733546.100003.48347
PigmentCarbon black1333-86-40.024050.200000.11421
PolymerEpoxy resin systemProprietary1.065678.862005.06074
Phenolic resinProprietary0.710455.908003.37383
Pre-PlatingPure metal layerGold (Au)7440-57-50.003603.000000.01707
Nickel (Ni)7440-02-00.1106292.300000.52533
Palladium (Pd)7440-05-30.003723.100000.01764
Silver (Ag)7440-22-40.001921.600000.00911
WirePure metalCopper (Cu)7440-50-80.03828100.000000.18178
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.