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Chemical content 74LVC1G79GS

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
74LVC1G79GSSOT1202X2SON60.90573 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352929191324126030 s124020 s3Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03045100.000003.36147
subTotal0.03045100.000003.36147
ComponentAdditiveNon hazardousProprietary0.000505.000000.05520
FillerBisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.000505.000000.05520
Silica -amorphous-7631-86-90.0050050.000000.55204
PolymerEpoxy resin systemProprietary0.0030030.000000.33122
Phenol Formaldehyde resin (generic)9003-35-40.0010010.000000.11041
subTotal0.01000100.000001.10407
Lead FrameCopper alloyChromium (Cr)7440-47-30.000910.240000.10069
Copper (Cu)7440-50-80.3582694.2800039.55528
Tin (Sn)7440-31-50.000910.240000.10069
Zinc (Zn)7440-66-60.000800.210000.08811
Pure metal layerGold (Au)7440-57-50.000190.050000.02098
Nickel (Ni) - cas no. 7440-02-07440-02-00.018164.780002.00545
Palladium (Pd)7440-05-30.000760.200000.08391
subTotal0.38000100.0000041.95511
Mould CompoundFillerSilica -amorphous-7631-86-90.0900020.000009.93674
Silica fused60676-86-00.2902564.5000032.04597
Flame retardantMetal hydroxideProprietary0.013503.000001.49051
ImpuritySilicon Dioxide (SiO2)14808-60-70.002250.500000.24842
PigmentCarbon black1333-86-40.001350.300000.14905
PolymerPhenol Formaldehyde resin (generic)9003-35-40.009902.200001.09304
Phenolic resinProprietary0.011252.500001.24209
Tetramethylbiphenyl diglycidyl ether85954-11-60.031507.000003.47786
subTotal0.45000100.0000049.68368
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00007
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00011
Tin solderTin (Sn)7440-31-50.0200099.990002.20794
subTotal0.02000100.000002.20816
WireGold alloyGold (Au)7440-57-50.0151399.000001.67071
Palladium (Pd)7440-05-30.000151.000000.01688
subTotal0.01528100.000001.68759
total0.90573100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

China RoHS Information

Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Die
晶粒
OOOOOO
Component
元器件
OOOOOO
Lead Frame
引线框
OOOOOO
Mould Compound
注塑胶料
OOOOOO
Post-Plating
后电镀
OOOOOO
Wire
线
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials` hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogenuous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
Remark: All Nexperia products have an environmental friendly use period (EFUP) of 50 years.
disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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