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Chemical content 74LVC273BQ

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Type numberPackagePackage descriptionTotal product weight
74LVC273BQSOT764-1DHVQFN2027.98455 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736771151612601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24410
PolymerResin systemProprietary0.0169719.900000.06064
subTotal0.08528100.000000.30474
DieDoped siliconSilicon (Si)7440-21-30.29554100.000001.05607
subTotal0.29554100.000001.05607
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.83931
Iron (Fe)7439-89-60.260742.400000.93172
Phosphorus (P)7723-14-00.003260.030000.01165
Zinc (Zn)7440-66-60.010860.100000.03882
subTotal10.86402100.0000038.82150
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70276
FillerSilica -amorphous-7631-86-90.571483.490002.04214
Silica fused60676-86-013.8892084.8200049.63167
PigmentCarbon black1333-86-40.026200.160000.09362
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63195
Epoxy resin systemProprietary0.260361.590000.93037
Phenolic resinProprietary0.368442.250001.31657
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16502
subTotal16.37491100.0000058.51410
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00985
Nickel (Ni)7440-02-00.2509591.000000.89675
Palladium (Pd)7440-05-30.022068.000000.07883
subTotal0.27577100.000000.98543
WirePure metalCopper (Cu)7440-50-80.0859796.550000.30719
Pure metal layerGold (Au)7440-57-50.000310.350000.00111
Palladium (Pd)7440-05-30.002763.100000.00986
subTotal0.08904100.000000.31816
total27.98455100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.