Chemical content 74LVT16374ADGG

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Type numberPackagePackage descriptionTotal product weight
74LVT16374ADGGSOT362-1TSSOP48204.30279 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352030101181612601235Nijmegen, Netherlands; D-22529 HAMBURG, Germany; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2259177.900000.11058
PolymerAcrylic resinProprietary0.0440815.200000.02158
Resin systemProprietary0.020016.900000.00979
DieDoped siliconSilicon (Si)7440-21-31.13652100.000000.55629
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-876.6494097.0000037.51755
Nickel (Ni)7440-02-02.370603.000001.16034
Mould CompoundFillerSilica -amorphous-7631-86-90.732000.600000.35829
Silica fused60676-86-095.5626078.3300046.77499
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-87.442006.100003.64263
PigmentCarbon black1333-86-40.244000.200000.11943
PolymerEpoxy resin systemProprietary10.811648.862005.29197
Phenolic resinProprietary7.207765.908003.52798
Pre-PlatingPure metal layerGold (Au)7440-57-50.015101.000000.00739
Nickel (Ni)7440-02-01.4647097.000000.71693
Palladium (Pd)7440-05-30.030202.000000.01478
WirePure metalCopper (Cu)7440-50-80.34628100.000000.16949
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.