Chemical content 74LVTH16374ADGG

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Type numberPackagePackage descriptionTotal product weight
74LVTH16374ADGGSOT362-1TSSOP48204.30279 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935289265118812601235Nijmegen, Netherlands; Suzhou, China; D-22529 HAMBURG, Germany; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.2259177.900000.11058
PolymerAcrylic resinProprietary0.0440815.200000.02158
Resin systemProprietary0.020016.900000.00979
DieDoped siliconSilicon (Si)7440-21-31.13652100.000000.55629
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-876.6494097.0000037.51755
Nickel (Ni)7440-02-02.370603.000001.16034
Mould CompoundAdditiveNon hazardousProprietary5.734004.700002.80662
FillerSilica fused60676-86-096.3800079.0000047.17508
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-87.320006.000003.58292
PigmentCarbon black1333-86-40.244000.200000.11943
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.880004.000002.38861
Non hazardousProprietary5.002004.100002.44833
Tetramethylbiphenyl diglycidyl ether85954-11-62.440002.000001.19431
Pre-PlatingPure metal layerGold (Au)7440-57-50.015101.000000.00739
Nickel (Ni)7440-02-01.4647097.000000.71693
Palladium (Pd)7440-05-30.030202.000000.01478
WirePure metalCopper (Cu)7440-50-80.34628100.000000.16949
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.